Advances in Condition Monitoring and Structural Health Monitoring, Volume 4 : Select Proceedings of WCCM 2024 (Lecture Notes in Mechanical Engineering)
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Advances in Condition Monitoring and Structural Health Monitoring, Volume 4 : Select Proceedings of WCCM 2024 (Lecture Notes in Mechanical Engineering)  Paperback,  言語:ENG

Shen, Gongtian (EDT)/ Gelman, Len (EDT)/ Hu, Bin (EDT)

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  • Springer Verlag, Singapore(2026/02発売)
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Advances in Condition Monitoring and Structural Health Monitoring, Volume 1 : Select Proceedings of WCCM 2024 (Lecture Notes in Mechanical Engineering)
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Advances in Condition Monitoring and Structural Health Monitoring, Volume 1 : Select Proceedings of WCCM 2024 (Lecture Notes in Mechanical Engineering)  Paperback,  言語:ENG

Shen, Gongtian (EDT)/ Gelman, Len (EDT)/ Hu, Bin (EDT)

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  • Springer Verlag, Singapore(2026/01発売)
  • ポイント 511pt
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Advances in Condition Monitoring and Structural Health Monitoring, Volume 3 : Select Proceedings of WCCM 2024 (Lecture Notes in Mechanical Engineering)
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Advances in Condition Monitoring and Structural Health Monitoring, Volume 3 : Select Proceedings of WCCM 2024 (Lecture Notes in Mechanical Engineering)  Paperback,  言語:ENG

Shen, Gongtian (EDT)/ Gelman, Len (EDT)/ Hu, Bin (EDT)

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Advances in Condition Monitoring and Structural Health Monitoring : WCCM 2019 (Lecture Notes in Mechanical Engineering)
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Advances in Condition Monitoring and Structural Health Monitoring : WCCM 2019 (Lecture Notes in Mechanical Engineering)  Paperback,  言語:ENG

Gelman, Len (EDT)/ Martin, Nadine (EDT)/ Malcolm, Andrew A. (EDT)

  • ウェブストア価格 ¥135,164(本体¥122,877)
  • Springer Verlag, Singapore(2021/02発売)
  • ポイント 1,228pt
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Transactions on Engineering Technologies : Proceedings of World Congress on Engineering 2021 (Lecture Notes in Electrical Engineering)
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Transactions on Engineering Technologies : Proceedings of World Congress on Engineering 2021 (Lecture Notes in Electrical Engineering)  Hardcover,  言語:ENG

Ao, Sio-Iong (EDT)/ Gelman, Len (EDT)

  • ウェブストア価格 ¥38,294(本体¥34,813)
  • Springer Verlag, Singapore(2022/09発売)
  • ポイント 348pt
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Transactions on Engineering Technologies : World Congress on Engineering 2019
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Transactions on Engineering Technologies : World Congress on Engineering 2019  Paperback,  言語:ENG

Ao, Sio-Iong (EDT)/ Gelman, Len (EDT)/ Kim, Haeng Kon (EDT)

  • ウェブストア価格 ¥38,294(本体¥34,813)
  • Springer Verlag, Singapore(2021/10発売)
  • ポイント 348pt
  • オンデマンド(OD/POD)版です。キャンセルは承れません。
Transactions on Engineering Technologies : World Congress on Engineering 2018
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Transactions on Engineering Technologies : World Congress on Engineering 2018  Paperback,  言語:ENG

Ao, Sio-Iong (EDT)/ Gelman, Len (EDT)/ Kim, Haeng Kon (EDT)

  • ウェブストア価格 ¥51,318(本体¥46,653)
  • Springer Verlag, Singapore(2021/08発売)
  • ポイント 466pt
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Transactions on Engineering Technologies : World Congress on Engineering 2019
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  • 電子版あり

Transactions on Engineering Technologies : World Congress on Engineering 2019  Hardcover,  言語:ENG

Ao, Sio-Iong (EDT)/ Gelman, Len (EDT)/ Kim, Haeng Kon (EDT)

  • ウェブストア価格 ¥38,294(本体¥34,813)
  • Springer Verlag, Singapore(2020/10発売)
  • ポイント 348pt
  • 海外取次在庫
Transactions on Engineering Technologies : World Congress on Engineering 2018
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  • 電子版あり

Transactions on Engineering Technologies : World Congress on Engineering 2018  Hardcover,  言語:ENG

Ao, Sio-Iong (EDT)/ Gelman, Len (EDT)/ Kim, Haeng Kon (EDT)

  • ウェブストア価格 ¥55,595(本体¥50,541)
  • Springer Verlag, Singapore(2020/01発売)
  • ポイント 505pt
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Transactions on Engineering Technologies : 25th World Congress on Engineering (WCE 2017)
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Transactions on Engineering Technologies : 25th World Congress on Engineering (WCE 2017)  Hardcover,  言語:ENG

Ao, Sio-Iong (EDT)/ Gelman, Len (EDT)/ Kim, Haeng Kon (EDT)

  • ウェブストア価格 ¥38,294(本体¥34,813)
  • Springer Verlag, Singapore(2018/08発売)
  • ポイント 348pt
  • 海外取次在庫