Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems)
  • 洋書
  • ポイントキャンペーン

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems)  Paperback,  言語:ENG

Cepeda-Rizo, Juan/ Gayle, Jeremiah/ Ravich, Joshua

  • ウェブストア価格 ¥14,587(本体¥13,261)
  • CRC Press(2024/08発売)
  • ポイント 660pt
  • 海外取次在庫
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems)
  • 洋書
  • 電子版あり
  • ポイントキャンペーン

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems)  Hardcover,  言語:ENG

Cepeda-Rizo, Juan/ Gayle, Jeremiah/ Ravich, Joshua

  • ウェブストア価格 ¥36,473(本体¥33,158)
  • CRC Press(2021/12発売)
  • ポイント 1,655pt
  • 海外取次在庫